Description The candidate will be responsible for conducting materials characterization and failure analysis in support of die prep technology development. In this role you will be working directly with 3 engineers supporting the material characterization and failure analysis of die prep technology development programs Skillsqualifications required, not limited to the following Top skills would be bull Optical Microscopy bull SEM (Scanning electron microscope), bull Cross-sectioningpolishing, ion mill, FIB (focused ion beam) Must possess good communication skills, work well with a team, deliver under pressure, and be well-organized. Basic computer skills (like Microsoft PowerPoint, Excel, Word etc) Candidate is expected to be flexible in working in multiple labs across 2 different work sitescampuses. (Candidate will be on the work site for the full day, not driving back and forth on a day) Minimum Education Associatersquos degree in science or engineering and 2-4 yearsrsquo experience in failure analysis, material analysis, process development, or analytical tool development. Preferred skills Knowledge of wafer fabrication and die prep process is beneficial.
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